- News
28 June 2012
OPEL completes second, $692,310 tranche of its $3m financing
In early June, OPEL Technologies Inc of Toronto, Ontario, Canada - which makes high-concentration photovoltaic (HCPV) panels and solar tracker systems through its subsidiary OPEL Solar Inc and develops III-V semiconductor devices and processes through US affiliate OPEL Defense Integrated Systems (ODIS Inc) of Shelton, CT - announced a financing arrangement for IBK Capital Corp to act as agent (on a best efforts basis) to conduct a private placement offering of up 13,043,478 units at a price of $0.23 each, to yield gross proceeds of up to $3m. Each unit consists of one common share and one common share purchase warrant (allowing the holder to acquire one common share for a period of three years at an exercise price of $0.35 per share).
The private placement has been conditionally accepted by the TSX Venture Exchange. The securities being issued are subject to a hold period that expires four months and one day following closing.
After a first tranche of the financing of $507,690 was completed on 8 June, a second tranche of $692,310 has now been completed, making $1.2m in total raised to date. The remaining $1.8m will be closed by 30 July, says OPEL.
OPEL is paying a cash commission of 7% of the funds raised and 10% of the units sold in the form of broker warrants (each allowing the holder to acquire one common share at a price of $0.23 for 48 months after the closing date).
OPEL announces board changes; refocus on developing POET technology, and $3m financing
OPEL Technologies POET GaAs ICs




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    Juno Publishing and Media Solutions Ltd. All rights reserved. Semiconductor
    Today and the editorial material contained within it and related media is
    the copyright of Juno Publishing and Media Solutions Ltd. Reproduction in
    whole or part without permission from Juno Publishing and Media Solutions
    Ltd is forbidden. In most cases, permission will be granted, if the magazine
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